Many fluxes also act as a wetting agentin the soldering process, reducing thesurface tensionof the molten solder and causing it to flow and wet the work pieces more easily.soldering. It meets the requirements of type rma as per MIL-F-14256. Advantageously, the flux does not substantially degrade the board's SIR because of the presence of a hydrophobic surfactant in the flux which is preferentially adsorbed by the board surface to render the surface hydrophobic. a) straight or branched carbon chains containing an alkyl group in which the molecular weight of the alkyl chain is greater than 48; b) straight or branched carbon chains containing an aryl chain in which the weight of the chain is greater than 189; c) straight or branch chain hydrophobes (alkyl and/or aryl groups) connected to the phosphate group by one or more polyethylene oxide or polypropylene oxide chains. To avoid this result, the flux of the present invention advantageously includes a hydrophobic surfactant comprised of either a mono-, di- or tri-alkyl or -aryl phosphate ester (or mixture thereof). It was ideal in that it was non-corrosive and non-conductive at normal temperatures but became mildly reactive (corrosive) at the elevated soldering temperatures. For water-soluble fluxes, activators of the organic acid variety are generally drawn from one or more of the group of low molecular weight (i.e., water-soluble) acids, e.g., citric, levulinic, acetic or oxalic acids. The various embodiments of the flux of the invention listed in Table II, like those in Table I, exhibit a log SIR value above 8, and thus represent a significant improvement over conventional water-soluble flux. For the embodiments listed in Table 1, the flux was chosen to be LONCO NF 3000 water-soluble flux, available from London Chemical Co., Bensenville, Illinois. The flux according to claim 2 CHARACTERISED IN THAT the inert oil comprises rosin in an amount not greater than 1% by weight of the flux. When molten solder is applied to the circuit board, the board (which is comprised of a polymer matrix) is invariably heated above the glass transition temperature. The activator and vehicle are chosen to act in a fashion similar to a conventional water-soluble flux to wet and clean metallized areas on the circuit board to facilitate soldering. As compared to the embodiments in Table 1, most of the embodiments in Table II, and especially those containing inert oil, were found to exhibit residues even after detergent cleaning. A water-soluble soldering flux, which, when applied to a circuit board or the like, does not degrade the surface insulation resistance of the board following the soldering and subsequent cleaning thereof, CHARACTERISED BY; The flux according to claim 1 further including an inert oil to increase the post-soldering hydrophobicity of the circuit board. A1, Designated state(s): LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES. Alternatively, the inert oil may be comprised a low level ( 1%) of rosin (abietic acid, isomers of abietic acid, and mixtures of those isomers or dimers of abietic acid and the isomers thereof). A water-soluble soldering flux which does not adversely impact the surface insulation resistance of a circuit board is comprised of a water-soluble vehicle, an activator and a hydrophobic surfactant preferentially adsorbed at the board surface. Following electroplating of the solder, flux is sometimes applied to the plated solder before the circuit board is subjected to heating in an oven to reflow the solder. The flux according to claim 3 CHARACTERISED IN THAT the solvent comprises isopropyl alcohol. with resistor electrically connecting electric components or wires to printed circuits by soldering, Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces, MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR, SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. The metal complexing-type activators constitute between 0-5% by weight of the flux. 19960111, Free format text: It also meets J-STD-004 Type ROLO. FLAME CUTTING; WORKING BY LASER BEAM, Rods, electrodes, materials, or media, for use in soldering, welding, or cutting, Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material, Selection of non-metallic compositions, e.g. Typically, the vehicle comprises a pure polyethylene or polypropylene glycol or a surfactant that has either a polyethylene glycol (polyethoxylate) or polypropylene glycol (polypropoxylate) chain as its hydrophilic portion. This effect is accelerated as the soldering temperatures increase andcan completely prevent the solder from joining to the workpiece. These fluxes cannot be used in electronics because they are conductive and because they will eventually dissolve the small diameter wires. Increasing the polypropylene oxide chain requires a corresponding increase in the size of the alkyl and aryl chains to maintain the same SIR level. We hope you will be completely satisfied with your orderbut, if an item does not meet your expectations, you may return it in as-new condition within 30 days of delivery for a replacement, exchange or refund of the purchase price. AS-RMA is made to meet the demands of high-speed soldering applications. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest, Selection of non-metallic compositions, e.g. Plumbing and automotive applications, amongothers, typically use an acid-based flux which provides cleaning of the joint. Various modifications and changes may be made thereto by those skilled in the art which will embody the principles of the invention and fall within the spirit and scope thereof. Significant residues are defined as those which adversely impact testing of the circuit board or which present a cosmetically unacceptable appearance after cleaning. Whether you need to strip micro-sized wires or assemble brass models, Micro-Mark has the right soldering tools for you. The flux according to claim 1 CHARACTERISED IN THAT the hydrophobic surfactant is selected from the group of mono-, di-, tri-alkyl and -aryl phosphate esters and mixtures thereof, straight or branched carbon chain containing an alkyl group in which the molecular weight of the alkyl chain is greater than 48, straight or branched carbon chains containing an aryl group in which the molecular weight of the aryl chain is greater than 189, and/or straight or branched carbon chains containing an alkyl group and/or aryl groups in which the chain is connected to a phosphate group by an oxide selected from one of the group of polypropylene and polyethylene oxides. The hydrophobic surfactant, which is chosen for its preferential adsorption, acts to fill the interstices in the of the substrate when the circuit board is heated above. For this reason, electronic equipment purchasers often demand that the circuit boards within the equipment they purchase meet or exceed a certain minimum SIR level, typically 3000 megohms. Therefore, used AS-No Clean reduces production costs. To increase the hydrophobicity of the circuit board following soldering, an inert oil may be added to the flux. Briefly, in accordance with the invention, a soldering flux is disclosed which is both water-soluble and which does not degrade the SIR of a polymer matrix substrate, such as a circuit board, after aqueous cleaning. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents, International Business Machines Corporation, STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT, Foaming flux for automatic soldering process, Water soluble soldering preflux and method of application, No-clean soldering flux and method using the same, Rosin-free, low VOC, no-clean soldering flux and method using the same, Simplification of ball attach method using super-saturated fine crystal flux, Fluxes for flip chip assembly using water soluble polymers, Flux composition and process for use thereof, Water-solubility dip coating tin scaling powder and preparation thereof, Water immiscible rosin mildly activated flux, Low-rosin washing-free soldering flux for lead-free flux-cored wires and preparation method thereof, Welding-bonding dual-purpose halogen-free electronic addition agent and preparation method thereof, Environment-friendly water cleaning type soldering flux, Halogen-free water-soluble soldering flux and preparation method thereof, Process for soldering using a phosphorus-containing liquid flux, Soldering flux with cationic surfactant and method for preparing a substrate surface for application of solder using the same, Detergent and method for cleaning rosin-based solder flux, Solder paste formulation containing stannous fluoride, Organic acid activated liquid solder flux, Water soluble adhesive coating for mounting components to printed wiring boards, Method of cleaning printed circuit boards using water, Solder paste and soldering method of the same, SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD FOR Sn ALLOY, Water-soluble flux composition and process for producing soldered part, Coated printed circuit wiring board and method of soldering, Method and composition for protecting and enhancing the solderability of metallic surfaces, Public reference made under article 153(3) epc to a published international application that has entered the european phase, Party data changed (applicant data changed or rights of an application transferred), Information on the status of an ep patent application or granted ep patent, Annual fee paid to national office [announced via postgrant information from national office to epo], Gb: european patent ceased through non-payment of renewal fee, Lapsed in a contracting state [announced via postgrant information from national office to epo]. The oxide reducing agents typically constitute 0-10% by weight of the flux. Application of the flux to a circuit board can be facilitated by dissolving the activator, the hydrophobic surfactant, the vehicle and the inert oil in a solvent, such as isopropyl alcohol or the like. In the case of a polyethylene oxide chain, its content must be kept to a minimum while the chain of alkyl and aryl groups should be in excess of 48 and 189, respectively, as set forth above. Furthermore, the leftover residue does not have to be cleaned. While water-soluble fluxes offer the advantage of aqueous cleaning, such fluxes do posses a disadvantage as compared to rosin fluxes. The most common type of electronics soldering flux used in electronics is rosin-based, made of rosin drawn from pine trees. If cleaning or removal of the residue is necessary, it can be accomplished using saponifier in an aqueous cleaning system. The flux of the invention is comprised of an activator, a hydrophobic surfactant which is preferentially adsorbed by the surface of the circuit board to render the surface substantially hydrophobic, and a water-soluble vehicle for carrying the surfactant and the activator. The flux of the invention is well suited for use in the coating processes described previously during which solder is applied to metallized areas on a circuit board, such as by either the HASL process or by electroplating solder to the board. Founded in 1990, Array Solders has been a leading manufacturer of solder preforms, custom-shaped preforms for interconnect applications in microelectronics packaging and assembly. Whats more It can be used on electronic assemblies where flux residue removal is not possible. Upon removal from the solder bath, the circuit board is usually subjected to an air knife which levels the solder to reduce the incidence of solder "icicles" and other related defects such as excess (and unwanted) solder and solder between paths (i.e., solder crosses and shorts). Arrays preforms are used in highly engineered applications such as PCB, thermal fuse, die attach, connector, sealing/thermal interface and cable assembly supplying the electronics, semiconductor, RF/microwave, photonics, medical, aerospace and defense, renewable energy and general electronics industries. 69114930, Country of ref document: At the saturation level, the number of trapped polyglycol molecules is sufficient to attract a continuous film of water molecules. IGEPAL and PLURACOL are brands of polyglycol available from Rhone-Poulenc, Princeton, New Jersey, and BASF, Parsippany, New Jersey, respectively. Present day water-soluble fluxes usually contain water-soluble polyglycols which are hydrophilic. The flux according to claim 1 CHARACTERISED IN THAT the activator is selected from the group consisting of an organic acid and metal complexing material and an organoamine hydrohalide. The vehicle of the instant flux is chosen to be water-soluble and nonionic. with resistor, Assembling printed circuits with electric components, e.g. Further, the flux of the invention can also be used during the process of solder-bonding components to the circuit board. Typically, this process is carried out by first inserting each component's leads through metal-plated through holes in the board and then subjecting the board to a soldering operation (reflow or wave soldering). The flux of the present invention need not necessarily be obtained by doping LONCO NF 3000 flux in the manner set forth in Table I. It is excellent for tinning stranded wire as well as component leads and attaching lead frames to hybrid circuit assemblies. The flux of the present invention is applied, typically by brushing, spraying or foaming the flux on the circuit board after component insertion but prior to soldering. Micro-Mark's soldering & electrical department includes soldering irons, soldering tips, resistance soldering kits, torches for assembling metal components and, of course, solder and flux. This process is known in the industry as "Hot Air Solder Leveling" (HASL). Hereinafter, the term "coating process" will be used generically to describe the process of coating selected metallized areas on the circuit board with solder, such as by the HASL process or by solder electroplating followed by solder reflow. AS-Rosin is non-activated flux made of isopropyl alcohol and pure water white gum rosin. For more information on our solder preforms or other products, please use our contact form to connect with us or: Array Solders | 152 Myrtle Ave Jersey City, New Jersey 07305 | sales@arraysolders.com | (201) 997-1333 | All Rights Reserved 2022. With the presence in the instant flux of the hydrophobic surfactant, few if any of the polyglycol molecules of the vehicle become trapped in the board. Next, a fusing fluid (soldering flux) is applied to the circuit board to wet and clean the metallized areas. The flux according to claim 2 CHARACTERISED IN THAT the inert oil is selected from the group consisting of tall oil and mineral oil. AS-No Clean is a low residue, organic based, halide free flux. The process of circuit board assembly is generally carried out by first establishing metallized areas (e.g., copper) on a substrate of FR-4 or the like to establish a circuit pattern and thereafter applying a solder mask to the board to cover those metallized areas which are to be protected from further processing. Customer satisfaction is our No. It is to be understood that the above-described embodiments are merely illustrative of the principles of the invention.
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